Redux® pastes are a new range of one and two-part epoxy adhesives that cure at room temperature and can also be cured at elevated temperature for higheer levels o f mechanical performance.  They are supplied in cans and cartridges.

Redux® 810 is a two-component, high strength, high peel, multipurpose, corrosion-inhibiting adhesive for bonding composites, metal to metal and honeycomb.  It is also suitable for structural repair.

Redux® 830 is a two-component low density syntactic filler, also suitable for potting.

Redux® 840 is a single component foaming paste for honeycomb splicing.